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Product Selection Guide
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CoreRes Selection Guide

Process Type Typical Seal Temperature Typical Process
Environment
Suggested Products Comments Typical Applications
Plasma Processes HDPCVD PECVD 25~200℃ TMS,TEOS,SiH4,
NH3,SiF4,O2,
C2F6,N2O,CF4
EL-270
EL-270F
EL-270,EL-270F
Nano-filler Translucent Product for etching, Nano-particle generation. Low contamination, O2, Fluorine gas etching, CVD, PVD Deposition ashing, stripping Processes. Product with high temperature (320℃)
Dynamic :
- Door seals
- Gate valves
- Pendulum valves

Static :
- Chamber lid seals
- Exhaust valves
- Gas inlets/outlets
- Window seals
- Center rings

Carrier :
- Wafer/FPD
Support/Transport
Etching 25~200℃ CF4,C3F8,CHF3,
SF6,O2,H2,HBr,
BCl3,CCl4,Cl2
Ashing/Stripping 25~250℃ O2,CF4,CHF3,
NH3,H2O Vapor
Forming Gas
Thermal Processes SACVD 25~250℃ TEP,TEBO,TEOS,
O3,NF3
Metal CVD ALD LPCVD 25~300℃ Organic precursors,
WF6,TiCl4,SiH4,
HF,F2,Cl2,ClF3,
NF3,H2O Vapor,
O2,O3
- Quarts chamber
  seal
- Fittings
- Center ring
- Plenum seals
Oxidation Diffusion 150~300℃ N2,O2,H2O,
HCl,Cl2
Lamp Anneal RTP 150~300℃ Resistance to IR absorption
Wet Processes Wafer Prep 25~125℃ UPDI,Piranha,
SC-1,SC-2,O3,
HF(49%)
EL-270F
5080UP
5080UP-General purpose Product for CVD, ETch and all plasma processes. - Door/lid seals
- Drain seals
- Seals for
  chemical
  containers
- Fittings
- Seals for
  filters/connectors
- Flow meters
Etching 25~180℃ HNO3,HF,H2O,
H3PO4,HNO3
Photolithography 25~125℃ H2SO4+Oxidant,
Organic Acids,nMP
Stripping 25~125℃ nMP/Alkanolamine
Hydroxlamine
Copper Plating 25~100℃ CuSO4 Solution
H2SO4,H2O2